Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ju Byeong Kwon | - |
| dc.contributor.author | 최승우 | - |
| dc.contributor.author | 최우범 | - |
| dc.contributor.author | LEE YUN HI | - |
| dc.contributor.author | KIM BYUNG HO | - |
| dc.contributor.author | OH MYUNG HWAN | - |
| dc.date.accessioned | 2024-01-13T16:31:04Z | - |
| dc.date.available | 2024-01-13T16:31:04Z | - |
| dc.date.created | 2021-09-29 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/108891 | - |
| dc.language | English | - |
| dc.subject | wafer bonding | - |
| dc.title | The effect of 02 plasma treatment on anodic bonding | - |
| dc.type | Conference | - |
| dc.description.journalClass | 2 | - |
| dc.identifier.bibliographicCitation | 제 7 회 반도체 학술대회, pp.659 - 660 | - |
| dc.citation.title | 제 7 회 반도체 학술대회 | - |
| dc.citation.startPage | 659 | - |
| dc.citation.endPage | 660 | - |
| dc.citation.conferencePlace | KO | - |
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