Study on glass-to-silicon anodic bonding using hydrophilic process

Authors
Ju Byeong Kwon이덕중장진OH MYUNG HWAN
Citation
제 7 회 반도체 학술대회, pp.645 - 646
Keywords
wafer bonding
URI
https://pubs.kist.re.kr/handle/201004/108895
Appears in Collections:
KIST Conference Paper > Others
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