DSpace at KISTKIST Conference PaperOthers

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dc.contributor.authorDuck-Jung Lee-
dc.contributor.authorJu Byeong Kwon-
dc.contributor.authorNam-Yang Lee-
dc.contributor.authorSeong-Jae Jeong-
dc.contributor.authorJin-Jang-
dc.contributor.authorOH MYUNG HWAN-
dc.date.accessioned2024-01-13T17:00:30Z-
dc.date.available2024-01-13T17:00:30Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/109122-
dc.languageEnglish-
dc.subjectFED-
dc.subjectFEA-
dc.subjectMEMS-
dc.titleApplication of electrostatic bonding to FED packaging-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationIVMC '99, pp.44 - 45-
dc.citation.titleIVMC '99-
dc.citation.startPage44-
dc.citation.endPage45-
dc.citation.conferencePlaceGW-
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