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Flip chip bonder for automactic parallel aligning of IR sensors and read out integrated circuits

Other Titles

적외선 센서/ROIC 접합을 위한 자동 평행 배열 flip chip bonder

Authors

SUH SANG HEE; SONG JONG HYEONG; AN SE YOUNG; KIM JIN SANG

Citation

제 10 회 적외선 영상 센서 Conference, pp.134 - 139

Keywords

자동 평행 배열

URI

https://pubs.kist.re.kr/handle/201004/109540

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KIST Conference Paper > Others

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