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Tubeless packaging of field emission display using glass to glass electrostatic bonding technology

Authors

정지원; Ju Byeong Kwon; 이덕중; LEE YUN HI; N. Y. Lee; Y. W. Ko; Y. G. Moon; CHOI DOO JIN; OH MYUNG HWAN

Citation

Proc. IVMC '98, pp.42 - 43

Keywords

MEMS

URI

https://pubs.kist.re.kr/handle/201004/110015

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KIST Conference Paper > Others

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