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dc.contributor.authorJu Byeong Kwon-
dc.contributor.author이덕중-
dc.contributor.author정지원-
dc.contributor.authorKim Hun-
dc.contributor.author이상조-
dc.contributor.authorLEE NAM YANG-
dc.contributor.author장진-
dc.contributor.authorOH MYUNG HWAN-
dc.date.accessioned2024-01-13T19:00:45Z-
dc.date.available2024-01-13T19:00:45Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/110205-
dc.languageEnglish-
dc.subjectMEMS-
dc.titleVacuum packaging of field emitter array using electrostatically-bonded glass-Si-glass/glass-glass structure-
dc.title.alternative정전 열 접합된 유리 -Si- 유리 / 유리 - 유리 구조물을 이용한 전계 방출 소자의 진공 패키징-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation대한전기학회 MEMS 연구회 학술발표회 논문집, pp.101 - 106-
dc.citation.title대한전기학회 MEMS 연구회 학술발표회 논문집-
dc.citation.startPage101-
dc.citation.endPage106-
dc.citation.conferencePlaceKO-
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