DSpace at KISTKIST Conference PaperOthers

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dc.contributor.authorJu Byeong Kwon-
dc.contributor.author최우범-
dc.contributor.authorS. J. Jeong-
dc.contributor.authorLEE NAM YANG-
dc.contributor.authorJ. I. Han-
dc.contributor.authorK. I. Cho-
dc.contributor.authorOH MYUNG HWAN-
dc.date.accessioned2024-01-13T20:34:04Z-
dc.date.available2024-01-13T20:34:04Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/111206-
dc.languageEnglish-
dc.subjectFED-
dc.subjectwafer bonding-
dc.subjectpackaging-
dc.titleNew Vacuum packaging method of field emission display-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationProc. SPIE far east and pacific rim syomposium on smart materials, structures, and MEMS, Adelaide, A, v.3242, pp.?-
dc.citation.titleProc. SPIE far east and pacific rim syomposium on smart materials, structures, and MEMS, Adelaide, A-
dc.citation.volume3242-
dc.citation.startPage?-
dc.citation.endPage?-
dc.citation.conferencePlaceAT-
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