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The properties of nitrogen implanted tungsten diffusion barrier for Cu metallization.

Authors

Kim Yong Tae; C. S. Kwon; D. J. Kim; J. Y. Lee; I. H. Choi

Citation

Proc. of the 2nd Korea-China symp. on ion beam modification of materials and thin film materials, pp.?

URI

https://pubs.kist.re.kr/handle/201004/111809

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KIST Conference Paper > Others

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