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dc.contributor.authorKim Yong Tae-
dc.contributor.author이창우-
dc.contributor.author권철순-
dc.date.accessioned2024-01-13T22:30:38Z-
dc.date.available2024-01-13T22:30:38Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/112066-
dc.languageEnglish-
dc.titleThermal stability of plasma deposited tungsten nitride thin films for VLSI devices.-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitation1-st China-Korea sym. on thin film materials, pp.?-
dc.citation.title1-st China-Korea sym. on thin film materials-
dc.citation.startPage?-
dc.citation.endPage?-
dc.citation.conferencePlaceCC-
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