Formation of silicon diaphragm using silicon-wafer direct bonding / electrochemical etch-stopping and its application to silicon pressure sensor fabrication

Title
Formation of silicon diaphragm using silicon-wafer direct bonding / electrochemical etch-stopping and its application to silicon pressure sensor fabrication
Authors
주병권하병주김근섭송만호김성환김철주차균현오명환
Keywords
MEMS; micromachining; wafer bonding; electrochemical etch stop; micromechanical structure; pressure sensor
Issue Date
1994-10
Publisher
센서학회지
Citation
VOL 3, NO 3, 45-53
URI
http://pubs.kist.re.kr/handle/201004/11339
ISSN
1225-5475
Appears in Collections:
KIST Publication > Article
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