Ultra-stretchable and biodegradable elastomers for soft, transient electronics

Authors
Han, Won BaeKo, Gwan-JinLee, Kang-GonKim, DonghakLee, Joong HoonYang, Seung MinKim, Dong-JeShin, Jeong-WoongJang, Tae-MinHan, SungkeunZhou, HongleiKang, HeeseokLim, Jun HyeonRajaram, KavetiCheng, HuanyuPark, Yong-DooKim, Soo HyunHwang, Suk-Won
Issue Date
2023-04
Publisher
Nature Publishing Group
Citation
Nature Communications, v.14, no.1
Abstract
As rubber-like elastomers have led to scientific breakthroughs in soft, stretchable characteristics-based wearable, implantable electronic devices or relevant research fields, developments of degradable elastomers with comparable mechanical properties could bring similar technological innovations in transient, bioresorbable electronics or expansion into unexplored areas. Here, we introduce ultra-stretchable, biodegradable elastomers capable of stretching up to similar to 1600% with outstanding properties in toughness, tear-tolerance, and storage stability, all of which are validated by comprehensive mechanical and biochemical studies. The facile formation of thin films enables the integration of almost any type of electronic device with tunable, suitable adhesive strengths. Conductive elastomers tolerant/sensitive to mechanical deformations highlight possibilities for versatile monitoring/sensing components, particularly the strain-tolerant composites retain high levels of conductivities even under tensile strains of similar to 550%. Demonstrations of soft electronic grippers and transient, suture-free cardiac jackets could be the cornerstone for sophisticated, multifunctional biodegradable electronics in the fields of soft robots and biomedical implants. Stretchable and degradable elastomers are crucial for developing transient and bioresorbable electronics. Herein, Han et al. tuned the diverse properties of biodegradable PLCL elastomers and demonstrated their application in soft, perceptive robotic grippers and transient, suture-free cardiac jackets.
Keywords
DEGRADATION BEHAVIOR; DESIGN
ISSN
2041-1723
URI
https://pubs.kist.re.kr/handle/201004/113791
DOI
10.1038/s41467-023-38040-4
Appears in Collections:
KIST Article > 2023
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