A low temperature direct bonding method using an electron-beam evaporated silicon-oxide interlayer

Title
A low temperature direct bonding method using an electron-beam evaporated silicon-oxide interlayer
Authors
주병권이윤희오명환H. W. ParkJ. H. ParkN. Y. LeeK. H. KohD. K. ShinI. B. KangN. SamaanM. R. Haskard
Keywords
MEMS
Issue Date
1996-12
Publisher
MRS 1996 fall meeting, Boston, USA.
Citation
, ?-?
URI
http://pubs.kist.re.kr/handle/201004/11858
Appears in Collections:
KIST Publication > Conference Paper
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