Effects of post-pattern annealing on electromigration in Al-2Cu interconnects

Title
Effects of post-pattern annealing on electromigration in Al-2Cu interconnects
Authors
한준현신명철
Keywords
electromigration; interconnect; annealing
Issue Date
1997-01
Publisher
대한금속학회지; J. of the Korean inst. of met. & mater.
Citation
VOL 35, NO 11, 1555-1560
URI
http://pubs.kist.re.kr/handle/201004/11977
Appears in Collections:
KIST Publication > Article
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