DSpace at KISTKIST PublicationConference Paper

New packaging method of field emission display using silicon-to-ITO coated glass bonding

Title
New packaging method of field emission display using silicon-to-ITO coated glass bonding
Authors
정지원; 주병권; 최우범; 이덕중; 이윤희; 이남양; Seong Jae Jung; 최두진; 오명환
Keywords
MEMS; FED; wafer bonding
Issue Date
1997-01
Publisher
Proc. IVMC '97, Kyungju, Korea
Citation
, 711-715
URI
http://pubs.kist.re.kr/handle/201004/12041
Appears in Collections:
KIST Publication > Conference Paper
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML
Show Full Item Record


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE