New packaging method of field emission display using silicon-to-ITO coated glass bonding

Title
New packaging method of field emission display using silicon-to-ITO coated glass bonding
Authors
정지원주병권최우범이덕중이윤희이남양Seong Jae Jung최두진오명환
Keywords
MEMS; FED; wafer bonding
Issue Date
1997-01
Publisher
Proc. IVMC '97, Kyungju, Korea
Citation
, 711-715
URI
http://pubs.kist.re.kr/handle/201004/12041
Appears in Collections:
KIST Publication > Conference Paper
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