Enhancement of adhesion between Cu thin film and polyimide modified by ion assisted reaction

Title
Enhancement of adhesion between Cu thin film and polyimide modified by ion assisted reaction
Authors
고석근K. H. KimS. C. ChoiC. N. Whang정형진
Issue Date
1997-12
Publisher
Mat. res. soc. symp.
Citation
, ?-?
URI
http://pubs.kist.re.kr/handle/201004/12165
Appears in Collections:
KIST Publication > Conference Paper
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