Modified low-temperature direct bonding method for vacuum microelectronics application

Title
Modified low-temperature direct bonding method for vacuum microelectronics application
Authors
주병권이덕중최우범이윤희장진이광배오명환
Keywords
MEMS; vacuum miroelectronics; wafer bonding
Issue Date
1997-03
Publisher
SPIE proceedings
Citation
VOL 3046, 342-348
URI
http://pubs.kist.re.kr/handle/201004/12169
Appears in Collections:
KIST Publication > Conference Paper
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