Ultrathin Plasmonic Optical/Thermal Barrier: Flashlight-Sintered Copper Electrodes Compatible with Polyethylene Terephthalate Plastic Substrates

Abstract

In recent years, highly conductive, printable electrodes have received tremendous attention in various research fields as the most important constituent components for large-area, low-cost electronics. In terms of ari indispensable sintering process for generating electrodes from printable metallic nanomaterials, a flashlight-based sintering technique has been regarded as a viable approach for continuous roll-to roll processes. In this paper, we report cost-effective, printable Cu electrodes that can be applied to vulnerable polyethylene terephthalate (PET) substrates, by incorporating a heretofore unrecognized ultrathin plasmonic thermal/optical barrier, which is composed of a 30 nm thick Ag nanoparticle (NP) layer. The different plasmonic behaviors during a flashlight-sintering process are investigated for both Ag and Cu NPs, based on a combined interpretation of the experimental results and theoretical calculations. It is demonstrated that by a continuous printing process and a continuous flashlight-sintering process, the Cu electrodes are formed successfully on large PET substrates, with a sheet resistance of 0.24 Omega/sq and a resistivity of 22.6 mu Omega.cm.