Effect of substrate surfaces and heat treatments on adhesion of Cu films

Title
Effect of substrate surfaces and heat treatments on adhesion of Cu films
Authors
최광진조영상
Keywords
PECVD; substrate surfaces; heat treatments; adhesion; Cu films
Issue Date
1997-08
Publisher
Materials letters
Citation
VOL 32, NO 2/3, 185-189
URI
http://pubs.kist.re.kr/handle/201004/12274
ISSN
0167-577X
Appears in Collections:
KIST Publication > Article
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