Glass-to-glass electrostatic bonding for FED tubeless packaging application

Title
Glass-to-glass electrostatic bonding for FED tubeless packaging application
Authors
주병권최우범이윤희정성재이남양한정인조경익오명환
Keywords
MEMS
Issue Date
1998-11
Publisher
Microelectronics journal
Citation
VOL 29, 839-844
URI
http://pubs.kist.re.kr/handle/201004/12517
ISSN
0026-2692
Appears in Collections:
KIST Publication > Article
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