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dc.contributor.authorKim, Jin-Seong-
dc.contributor.authorHan, Jae-Min-
dc.contributor.authorJoung, Mi-Ri-
dc.contributor.authorKweon, Sang-Hyo-
dc.contributor.authorKang, Chong-Yun-
dc.contributor.authorNahm, Sahn-
dc.date.accessioned2024-01-20T08:33:13Z-
dc.date.available2024-01-20T08:33:13Z-
dc.date.created2021-09-02-
dc.date.issued2014-11-
dc.identifier.issn0272-8842-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/126204-
dc.description.abstractCrystalline (Zr,Ti)(0.85)(Ca,Sr)(0.15)O-1.85 (ZTCS) films were grown on a Pt/Ti/SiO2/Si substrate at various temperatures by using rf-magnetron sputtering. The ZTCS films had a cubic stabilized zirconia structure. The dielectric constant (k) of the ZTCS film grown at 300 degrees C was approximately 30.5 with a low tan delta value of 0.007 at 100 kHz. Further, this film exhibited a similar k value of 30.4 and a high quality factor of 225 at 1.0 GHz. Moreover, it showed a high capacitance density of 290 nF/cm(2) with a small TCC of -60.7 ppm/degrees C at 100 kHz. A low leakage current (1.4 x 10(-8) A/cm(2) at 1.5 MV/cm) with a high breakdown electric field (1.85 MV/cm) was also observed in this film; the leakage current of this film was explained by Schottky emission. Therefore, it can be concluded that ZTCS films grown at low temperatures ( <= 300 degrees C) are good candidates for use as embedded capacitor in printed circuit boards. (c) 2014 Elsevier Ltd and Techna Group S.r.l. All rights reserved.-
dc.languageEnglish-
dc.publisherELSEVIER SCI LTD-
dc.subjectDECOUPLING CAPACITORS-
dc.subjectEMBEDDED CAPACITORS-
dc.subjectMIM CAPACITORS-
dc.subjectTEMPERATURE-
dc.subjectRESISTORS-
dc.subjectBEHAVIOR-
dc.subjectLEAKAGE-
dc.titleElectrical properties of (Zr,Ti)(0.85)(Ca,Sr)(0.15)O-1.85 thin film grown on Pt/Ti/SiO2/Si substrate using RF magnetron sputtering-
dc.typeArticle-
dc.identifier.doi10.1016/j.ceramint.2014.06.093-
dc.description.journalClass1-
dc.identifier.bibliographicCitationCERAMICS INTERNATIONAL, v.40, no.9, pp.14957 - 14964-
dc.citation.titleCERAMICS INTERNATIONAL-
dc.citation.volume40-
dc.citation.number9-
dc.citation.startPage14957-
dc.citation.endPage14964-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000341343300052-
dc.identifier.scopusid2-s2.0-84906101325-
dc.relation.journalWebOfScienceCategoryMaterials Science, Ceramics-
dc.relation.journalResearchAreaMaterials Science-
dc.type.docTypeArticle-
dc.subject.keywordPlusDECOUPLING CAPACITORS-
dc.subject.keywordPlusEMBEDDED CAPACITORS-
dc.subject.keywordPlusMIM CAPACITORS-
dc.subject.keywordPlusTEMPERATURE-
dc.subject.keywordPlusRESISTORS-
dc.subject.keywordPlusBEHAVIOR-
dc.subject.keywordPlusLEAKAGE-
dc.subject.keywordAuthorDielectric-
dc.subject.keywordAuthorThin film-
dc.subject.keywordAuthorEmbedded capacitor-
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KIST Article > 2014
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