Tubeless packaging of field emission display using glass to glass electrostatic bonding technology

Title
Tubeless packaging of field emission display using glass to glass electrostatic bonding technology
Authors
정지원주병권이덕중이윤희N. Y. LeeY. W. KoY. G. Moon최두진오명환
Keywords
MEMS
Issue Date
1998-07
Publisher
Proc. IVMC '98
Citation
, 42-43
URI
http://pubs.kist.re.kr/handle/201004/12681
Appears in Collections:
KIST Publication > Conference Paper
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