Glass-to-glass bonding for vacuum packaging of field emission display in an ultra-high-vacuum chamber using silicon thin film

Title
Glass-to-glass bonding for vacuum packaging of field emission display in an ultra-high-vacuum chamber using silicon thin film
Authors
W. B. Choi주병권이윤희S. J. JeongN. Y. LeeM. Y. Sung오명환
Issue Date
1999-01
Publisher
Journal of the Electrochemical Society
Citation
VOL 146, NO 1, 400-404
URI
http://pubs.kist.re.kr/handle/201004/12844
ISSN
0013-4651
Appears in Collections:
KIST Publication > Article
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