MEMS/FED packaging 기술 동향 (I) : 기판 접합 공정 중심으로

Title
MEMS/FED packaging 기술 동향 (I) : 기판 접합 공정 중심으로
Authors
주병권오명환
Keywords
MEMS; FED
Issue Date
1999-01
Publisher
전자부품; The Electronic Parts & Components Monthly
Citation
, 66-79
URI
http://pubs.kist.re.kr/handle/201004/12845
Appears in Collections:
KIST Publication > ETC
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