HF 전처리시 Si 기판 직접접합의 초기접합 모델

Title
HF 전처리시 Si 기판 직접접합의 초기접합 모델
Authors
주병권강경두박진성정수태정귀상
Keywords
wafer bonding
Issue Date
1999-11
Publisher
센서학회 종합학술대회
Citation
, 327-330
URI
http://pubs.kist.re.kr/handle/201004/12939
Appears in Collections:
KIST Publication > Conference Paper
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