Vacuum packaging using anodic bonding and emission characteristics of FED

Title
Vacuum packaging using anodic bonding and emission characteristics of FED
Authors
이덕중주병권정지원김훈Sung-Jae Jung장진오명환
Keywords
FED; FEA; MEMS; Glass bonding; silicon film; leak test; packaged FED; light emission; sta
Issue Date
1999-03
Publisher
Proc. ASID '99
Citation
, 53-56
URI
http://pubs.kist.re.kr/handle/201004/13019
Appears in Collections:
KIST Publication > Conference Paper
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