임베디드 커패시터용 세라믹(BaTiO3)-고분자(에폭시) 필름의 세라믹 분말 형상 및 함량에 따른 전기적 특성

Abstract

The ceramic(BaTiO3)-polymer(epoxy) composites have been widely investigated as dielectric materials for embedded capacitors in printed circuit boards (PCBs). The dielectric properties of BaTiO3/epoxy composites prepared using the agglomerated BaTiO3 particles were investigated in the present study. The dielectric constants of the composites prepared using the agglomerated BaTiO3 particles were about 2 times higher than those of the composites with the dispersed BaTiO3 particles. The insulation resistance of the composites prepared using the agglomerated BaTiO3 particles were lower than those of the composites with dispersed BaTiO3 particles. As a result, there is tradeoff between high dielectric constant and insulation resistance in the BaTiO3/epoxy composites. So it is important to select proper agglomerated or dispersed BaTiO3 particles in accordance with needs.