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dc.contributor.authorBali, R.-
dc.contributor.authorFleury, E.-
dc.contributor.authorHan, S. H.-
dc.contributor.authorAhn, J. P.-
dc.date.accessioned2024-01-20T23:03:47Z-
dc.date.available2024-01-20T23:03:47Z-
dc.date.created2021-09-03-
dc.date.issued2008-06-12-
dc.identifier.issn0925-8388-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/133395-
dc.description.abstractThe microstructure of Sn96.4Ag2.8Cu0.8 (at.%) solder alloy when rapidly quenched onto an Au surface finish has been found to range from nanometer to micrometer-sized features. This striking microstructure contained a spectrum of phases from the Au-Sn phase diagram, while Ag and Cu did not appear to participate in the solidification process. Within the solder contact, a eutectic with 40 nm interlamellar spacing was observed, along with the presence of layered intermetallics. Observations of these phases and their orientation offer better understanding of the solidification of Pb-free solders onto Au. (C) 2007 Elsevier B.V. All rights reserved.-
dc.languageEnglish-
dc.publisherELSEVIER SCIENCE SA-
dc.subjectLEAD-FREE SOLDER-
dc.subjectFLIP-CHIP-
dc.subjectMICROSTRUCTURAL EVOLUTION-
dc.subjectTENSILE PROPERTIES-
dc.subjectEUTECTIC SNPB-
dc.subjectALLOYS-
dc.subjectTECHNOLOGY-
dc.subjectCHALLENGES-
dc.titleInterfacial intermetallic phases and nanoeutectic in rapidly quenched Sn-Ag-Cu on Au under bump metallization-
dc.typeArticle-
dc.identifier.doi10.1016/j.jallcom.2007.02.129-
dc.description.journalClass1-
dc.identifier.bibliographicCitationJOURNAL OF ALLOYS AND COMPOUNDS, v.457, no.1-2, pp.113 - 117-
dc.citation.titleJOURNAL OF ALLOYS AND COMPOUNDS-
dc.citation.volume457-
dc.citation.number1-2-
dc.citation.startPage113-
dc.citation.endPage117-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.identifier.wosid000256124900025-
dc.identifier.scopusid2-s2.0-42649110729-
dc.relation.journalWebOfScienceCategoryChemistry, Physical-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMetallurgy & Metallurgical Engineering-
dc.relation.journalResearchAreaChemistry-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaMetallurgy & Metallurgical Engineering-
dc.type.docTypeArticle-
dc.subject.keywordPlusLEAD-FREE SOLDER-
dc.subject.keywordPlusFLIP-CHIP-
dc.subject.keywordPlusMICROSTRUCTURAL EVOLUTION-
dc.subject.keywordPlusTENSILE PROPERTIES-
dc.subject.keywordPlusEUTECTIC SNPB-
dc.subject.keywordPlusALLOYS-
dc.subject.keywordPlusTECHNOLOGY-
dc.subject.keywordPlusCHALLENGES-
dc.subject.keywordAuthormicrostructure-
dc.subject.keywordAuthorphase diagram-
dc.subject.keywordAuthortransmission electron microscopy-
dc.subject.keywordAuthorTEM-
dc.subject.keywordAuthorscanning electron microscopy-
dc.subject.keywordAuthorSEM-
dc.subject.keywordAuthorlaser processing-
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