Silver direct electrodeposition on Ru thin films

Authors
Koo, Hyo-CholCho, Sung KiLee, Chang HwaKim, Soo-KilKwon, Oh JoongKim, Jae Jeong
Issue Date
2008-05
Publisher
ELECTROCHEMICAL SOC INC
Citation
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.155, no.5, pp.D389 - D394
Abstract
Electrodeposition of Ag was performed on Ru thin films following electrochemical reduction of native Ru oxide. Oxide reduction in a tetramethylammonium hydroxide solution was critical for the formation of continuous Ag film, and a large overpotential was important for high-density nucleation. From a kinetics viewpoint, the thermal stability of the Ag film was improved by the application of a more negative potential, which suggested that better nucleation density at the initial stage of growth induced better substrate adhesion. Suppression of growth by addition of an organic additive generated a larger and more uniformly distributed initial population of Ag particles, and as a result a smooth film was obtained. (C) 2008 The Electrochemical Society.
Keywords
DIRECT COPPER ELECTRODEPOSITION; CHEMICAL-VAPOR-DEPOSITION; ATOMIC LAYER DEPOSITION; DIFFUSION BARRIER; CU METALLIZATION; RUTHENIUM; NUCLEATION; GROWTH; TIN; ADHESION; DIRECT COPPER ELECTRODEPOSITION; CHEMICAL-VAPOR-DEPOSITION; ATOMIC LAYER DEPOSITION; DIFFUSION BARRIER; CU METALLIZATION; RUTHENIUM; NUCLEATION; GROWTH; TIN; ADHESION; Ag; Electrodeposition; nucleation; additive
ISSN
0013-4651
URI
https://pubs.kist.re.kr/handle/201004/133539
DOI
10.1149/1.2890394
Appears in Collections:
KIST Article > 2008
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