The evaluation of adhesion energy in thin compressively stressed film by using delamination buckle and freehang buckle

Abstract

This study presents an evaluation technique of the adhesion energy by using delamination buckle and freehang buckle in thin compressive films. Based on the energy balance criterion, the fundamental adhesion energy has been evaluated with buckling geometries and elastic modulus of film. The freehang buckling by side etching of substrate has been used for evaluating elastic modulus. The adhesion energy change, affected by film thickness and negative bias voltage during deposition process, has been quantitatively estimated.