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Electromigration-induced via failure assisted by neighboring clusters

Authors
Choi, IS; Park, YJ; Joo, YC
Issue Date
2002-02-01
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Citation
SCRIPTA MATERIALIA, v.46, no.3, pp.247 - 251
Abstract
With different locations of a cluster, stress evolutions at a via are simulated. Via fails fastest at a specific location of a cluster, which is named fastest stress enhancing polygranular cluster position (FaSEPP). Suggested model and simulated results show that FaSEPP decreases with increasing current density but does not vary with temperature. (C) 2002 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.
Keywords
CONFINED METAL LINES; STRESS EVOLUTION; INTERCONNECTS; RELIABILITY; CONDUCTORS; CONFINED METAL LINES; STRESS EVOLUTION; INTERCONNECTS; RELIABILITY; CONDUCTORS; electromigration; computer simulatiom; interconnects
ISSN
1359-6462
URI
https://pubs.kist.re.kr/handle/201004/139775
DOI
10.1016/S1359-6462(01)01235-0
Appears in Collections:
KIST Article > 2002
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