DSpace at KIST: Flip chip bonder for automatic parallel aligning of IR sensor and read out integrated circuits

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DC Field	Value	Language
dc.contributor.author	서상희	-
dc.contributor.author	김진상	-
dc.contributor.author	안세영	-
dc.date.accessioned	2024-01-21T11:44:56Z	-
dc.date.available	2024-01-21T11:44:56Z	-
dc.date.created	2022-01-10	-
dc.date.issued	2001-09	-
dc.identifier.issn	1225-5475	-
dc.identifier.uri	https://pubs.kist.re.kr/handle/201004/140193	-
dc.publisher	한국센서학회	-
dc.title	Flip chip bonder for automatic parallel aligning of IR sensor and read out integrated circuits	-
dc.title.alternative	적외선 센서/ROIC 접합을 위한 자동 평행 배열 방식의 플립 칩 본더	-
dc.type	Article	-
dc.description.journalClass	2	-
dc.identifier.bibliographicCitation	센서학회지, v.10, no.5, pp.65 - 70	-
dc.citation.title	센서학회지	-
dc.citation.volume	10	-
dc.citation.number	5	-
dc.citation.startPage	65	-
dc.citation.endPage	70	-
dc.subject.keywordAuthor	flip chip bonder	-
dc.subject.keywordAuthor	적외선 검출기	-
dc.subject.keywordAuthor	ROIC	-

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