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Mechanical analysis for thermal cracking control in CVD-processed diamond thick films for electronic applications

Other Titles

웨이퍼용 CVD 다이아몬드 후막의 균열발생 제어를 위한 역학적 해석

Authors

정증현; 이소윤; 권동일; 이욱성; 백영준

Issue Date

2001-09

Publisher

대한금속.재료학회

Citation

대한금속 . 재료학회지 = Journal of the Korean Institute of Metals and Materials, v.39, no.9, pp.974 - 982

Keywords

diamond thick film; cracking; finite element analysis; thermal stress; interfacial adhesion

ISSN

1738-8228

URI

https://pubs.kist.re.kr/handle/201004/140203

Appears in Collections:

KIST Article > 2001

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