Mechanical analysis for thermal cracking control in CVD-processed diamond thick films for electronic applications

Title
Mechanical analysis for thermal cracking control in CVD-processed diamond thick films for electronic applications
Authors
정증현이소윤권동일이욱성백영준
Keywords
diamond thick film; cracking; finite element analysis; thermal stress; interfacial adhesion
Issue Date
2001-09
Publisher
대한금속 . 재료학회지; Journal of the Korean Institute of Metals and Materials
Citation
VOL 39, NO 9, 974-982
URI
http://pubs.kist.re.kr/handle/201004/14049
ISSN
1738-8228
Appears in Collections:
KIST Publication > Article
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