Mechanical analysis for thermal cracking control in CVD-processed diamond thick films for electronic applications
- Mechanical analysis for thermal cracking control in CVD-processed diamond thick films for electronic applications
- 정증현; 이소윤; 권동일; 이욱성; 백영준
- diamond thick film; cracking; finite element analysis; thermal stress; interfacial adhesion
- Issue Date
- 대한금속 . 재료학회지; Journal of the Korean Institute of Metals and Materials
- VOL 39, NO 9, 974-982
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- KIST Publication > Article
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