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Re-distribution of thermal residual stress in a brazed Si3N4/stainless steel joint using laminated interlayers

Authors

Kim, TW; Chang, HS; Park, SW

Issue Date

2001-05

Publisher

SPRINGER

Citation

JOURNAL OF MATERIALS SCIENCE LETTERS, v.20, no.10, pp.973 - 976

Keywords

SILICON-NITRIDE; SILICON-NITRIDE; brazing

ISSN

0261-8028

URI

https://pubs.kist.re.kr/handle/201004/140519

DOI

10.1023/A:1010965808405

Appears in Collections:

KIST Article > 2001

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