Effects of Si-dose on defect-related photoluminescence in Si-implanted SiO2 layers

Authors
Kim, HBKim, TGSon, JHWhang, CNChae, KHLee, WSIm, SSong, JH
Issue Date
2000-08-15
Publisher
AMER INST PHYSICS
Citation
JOURNAL OF APPLIED PHYSICS, v.88, no.4, pp.1851 - 1854
Abstract
Si ions were implanted into 100-nm-thick SiO2 layer thermally grown on crystalline Si at an energy of 55 keV with various doses ranging from 1x10(14) to 1x10(17) Si/cm(2) at room temperature. Si ions go through the interface between SiO2 layer and Si substrate generating defects in SiO2 layer and Si substrate as well. Defect-related phenomena were characterized by photoluminescence (PL) and electron spin resonance (ESR) measurements. The PL experiment shows that there exists a dose window for a maximum intensity of luminescence related to radiative defects, while the ESR exhibits that nonradiative defects change from E' centers to P-b centers as the dose increases. It is considered that the intensity is controlled by the density ratio of radiative to nonradiative defects induced by ion implantation. (C) 2000 American Institute of Physics. [S0021-8979(00)05716-9].
Keywords
ION-IMPLANTATION; LIGHT-EMISSION; SILICON DIOXIDE; CENTERS; NANOCRYSTALS; SIO2-FILMS; WAFERS; FILMS; ION-IMPLANTATION; LIGHT-EMISSION; SILICON DIOXIDE; CENTERS; NANOCRYSTALS; SIO2-FILMS; WAFERS; FILMS; Ion implantation; Photoluminescence; Radiative defects; SiO₂
ISSN
0021-8979
URI
https://pubs.kist.re.kr/handle/201004/141166
DOI
10.1063/1.1305909
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KIST Article > 2000
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