Packaging of the MEMS devices using thin silicon wafer

Title
Packaging of the MEMS devices using thin silicon wafer
Authors
박윤권김용국김훈이윤희김철주주병권
Keywords
Thin 웨이퍼; 패키징; FBAR
Issue Date
2002-11
Publisher
SENSORS CONFERENCE 2002
Citation
, 320-323
URI
http://pubs.kist.re.kr/handle/201004/14174
Appears in Collections:
KIST Publication > Conference Paper
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