Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 주병권 | - |
| dc.contributor.author | 오명환 | - |
| dc.date.accessioned | 2024-01-21T15:46:36Z | - |
| dc.date.available | 2024-01-21T15:46:36Z | - |
| dc.date.created | 2022-01-10 | - |
| dc.date.issued | 1999-02 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/142416 | - |
| dc.title | MEMS/FED packaging 기술 동향 (II) : 기판 접합 공정 중심으로 | - |
| dc.type | Article | - |
| dc.description.journalClass | 3 | - |
| dc.identifier.bibliographicCitation | 전자부품 = The Electronic Parts & Components Monthly, pp.130 - 137 | - |
| dc.citation.title | 전자부품 = The Electronic Parts & Components Monthly | - |
| dc.citation.startPage | 130 | - |
| dc.citation.endPage | 137 | - |
| dc.subject.keywordAuthor | MEMS | - |
- Appears in Collections:
- KIST Article > Others
- Files in This Item:
There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.
KIST 리포지터리는 국립중앙도서관 OAK 보급사업으로 구축되었습니다.