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Room temperature growth of Cu thin film by nozzle-type partially ionized beam deposition with various acceleration voltages.

Authors

고석근; 윤영수; 정형진; 김기환; 이지현

Issue Date

1996-01

Citation

Thin solid films, v.v. 278, pp.45 - 48

Keywords

deposition process

URI

https://pubs.kist.re.kr/handle/201004/144790

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KIST Article > Others

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