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The properties of nitrogen implanted tungsten diffusion barrier for Cu metallization.

Authors

김용태; C. S. Kwon; D. J. Kim; J. Y. Lee; I. H. Choi

Issue Date

1995-01

Citation

J. of the Korean vacuum soc., v.v. 4, pp.79 - 83

URI

https://pubs.kist.re.kr/handle/201004/145338

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KIST Article > Others

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