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Surface void nucleation under the power-law creep condition in an Al-3 at. pct Mg solid solution alloy

Authors
Lee, D.-H.; Shin, D.H.; Hong, K.T.; Nam, S.W.
Issue Date
1991-04
Publisher
Springer-Verlag
Citation
Metallurgical Transactions A, v.22, no.4, pp.935 - 937
Abstract
[No abstract available]
Keywords
Aluminum metallography; Auger electron spectroscopy; Cracks; Creep; Evaporation; Grain boundaries; Magnesium alloys; Mechanical properties; Solid solutions; Surface properties; Vapor pressure; Grain boundary migration; Power law relation; Void nucleation; Aluminum alloys; Aluminum metallography; Auger electron spectroscopy; Cracks; Creep; Evaporation; Grain boundaries; Magnesium alloys; Mechanical properties; Solid solutions; Surface properties; Vapor pressure; Grain boundary migration; Power law relation; Void nucleation; Aluminum alloys; void; power-law; creep; Al-Mg
ISSN
1073-5623
URI
https://pubs.kist.re.kr/handle/201004/146820
DOI
10.1007/BF02659003
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KIST Article > Others
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