Flexible polysilicon sensor array modules using "Etch-Release" Packaging Scheme

Title
Flexible polysilicon sensor array modules using "Etch-Release" Packaging Scheme
Authors
황은수김용준주병권
Keywords
flexible packaging; sensor array; release-etching; piezoresistivity; strain gauge
Issue Date
2003-05
Publisher
한국 MEMS 학술대회
Citation
, 40-45
URI
http://pubs.kist.re.kr/handle/201004/14706
Appears in Collections:
KIST Publication > Conference Paper
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