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Nitrogen effects of Ta-Si-N diffusion barrier in Si/Cu metallization.

Other Titles

Nitrogen effects of Ta-Si-N diffusion barrier in Si/Cu metallization.

Authors

Kim Yong Tae; S. P. Jeong; D. J. Kim; J. W. Park; Min Suk-Ki

Issue Date

1996-01

URI

https://pubs.kist.re.kr/handle/201004/148824

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