전자장치 액침냉각을 위한 마이크로핀에서의 비등열전달에 관한 실험적 연구

Other Titles
An experimental study on boiling heat transfer form microfin for immersion cooling of electronic equipments.
Authors
KARNG SARNG WOO전진석곽호영
Issue Date
1988-11
URI
https://pubs.kist.re.kr/handle/201004/148861
Appears in Collections:
KIST Publication > Others
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