Innovation ultra thin packaging for rf-mems devices.

Title
Innovation ultra thin packaging for rf-mems devices.
Authors
박윤권김용국김철주주병권Jong-Oh Park박윤권
Issue Date
2003-06
Publisher
IEEE TRANSDUCERS'03
Citation
, 903-906
URI
http://pubs.kist.re.kr/handle/201004/14982
Appears in Collections:
KIST Publication > Conference Paper
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE