Flexible module packaging using MEMS technology

Title
Flexible module packaging using MEMS technology
Authors
황은수최석문주병권김용준
Issue Date
2002-05
Publisher
마이크로 전자 및 패키징학회 춘계 기술 심포지움
Citation
, 74-78
URI
http://pubs.kist.re.kr/handle/201004/15676
Appears in Collections:
KIST Publication > Conference Paper
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE