Flip chip bonder for automatic parallel aligning of IR sensor and read out integrated circuits

Title
Flip chip bonder for automatic parallel aligning of IR sensor and read out integrated circuits
Authors
서상희김진상안세영
Keywords
flip chip bonder; 적외선 검출기; ROIC
Issue Date
2001-09
Publisher
센서학회지
Citation
VOL 10, NO 5, 65-70
URI
http://pubs.kist.re.kr/handle/201004/16251
ISSN
1225-5475
Appears in Collections:
KIST Publication > Article
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