Wafer level sealing technology of MEMS devices using B-stage epoxy

Title
Wafer level sealing technology of MEMS devices using B-stage epoxy
Authors
박흥우박윤권이덕중김철주박정호서용교김정우송기무오명환주병권
Keywords
hermetic
Issue Date
2001-04
Publisher
제 3 회 MEMS 학술대회
Citation
, 154-158
URI
http://pubs.kist.re.kr/handle/201004/16548
Appears in Collections:
KIST Publication > Conference Paper
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