A method of improving dielectric constant and adhesion strength of methysilsesquioxyane by using a NH3 plasma treatment

Title
A method of improving dielectric constant and adhesion strength of methysilsesquioxyane by using a NH3 plasma treatment
Authors
심현상김용태김동준전형탁추상현차국현
Keywords
low-k
Issue Date
2001-04
Publisher
Material Research Society (MRS) 2001 spring Meeting
Citation
, 231.-231.
URI
http://pubs.kist.re.kr/handle/201004/16577
Appears in Collections:
KIST Publication > Conference Paper
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