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Glass-to-glass electrostatic bonding with intermediate amorphous silicon film for vacuum packaging of microelectronics and its application

Title
Glass-to-glass electrostatic bonding with intermediate amorphous silicon film for vacuum packaging of microelectronics and its application
Authors
Duck-Jung Lee; 이윤희; Jin Jang; 주병권
Keywords
glass-to-glass bonding
Issue Date
2001-03
Publisher
Sensors and actuators. A, Physical
Citation
VOL 89, NO 1-2, 43-48
URI
http://pubs.kist.re.kr/handle/201004/16621
ISSN
0924-4247
Appears in Collections:
KIST Publication > Article
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