Application of electrostatic bonding to FED packaging

Title
Application of electrostatic bonding to FED packaging
Authors
Duck-Jung Lee주병권Nam-Yang LeeSeong-Jae JeongJin-Jang오명환
Keywords
FED; FEA; MEMS
Issue Date
1999-07
Publisher
IVMC '99
Citation
, 44-45
URI
http://pubs.kist.re.kr/handle/201004/17896
Appears in Collections:
KIST Publication > Conference Paper
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